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Fiber Optics
Small Form Factor Multimode 850 nm 1.0625 GBd Fibre Channel 1.25 Gigabit Ethernet Transceiver 2x5 Pinning with LCTM Connector
V23818-K305-Lxx
Features * Small Form Factor transceiver * Complies with Fibre Channel and Gigabit Ethernet standards * Excellent EMI performance * RJ-45 style LCTM connector system * Available with or without collar * Half the size of SC Duplex 1x9 transceiver * Single power supply (3.3 V) * Extremely low power consumption, 445 mW typical * LVPECL differential inputs and outputs * AC/AC coupling in accordance to SFF MSA or optional DC/DC coupling version * Optimized for 62.5/50 m graded index fiber * For distances of up to 700 m * Multisource 2x5 footprint1) * Small size for high port density * UL-94 V-0 certified * ESD Class 1 per MIL-STD 883D Method 3015.7 * Compliant with FCC (Class B) and EN 55022 * Class 1 FDA and IEC laser safety compliant
1)
Current MSA documentation can be found at www.infineon.com/fiberoptics
LCTM is a trademark of Lucent
Part Number V23818-K305-L17 V23818-K305-L57 V23818-K305-L15 V23818-K305-L55
Data Sheet
Voltage 3.3 V 3.3 V
Signal Detect Collar LVTTL LVTTL yes no
Input DC AC DC AC
Output DC AC DC AC
2003-01-22
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Pin Configuration Pin Configuration
Tx
MS
HL HL 10 9 8 7 6
TOP VIEW Rx MS
HL 12345 HL
File: 1331
Figure 1
Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 MS HL Symbol Level/Logic Ground Power supply LVTTL output LVPECL output LVPECL output Power supply Ground LVTTL input LVPECL input LVPECL input Description Receiver signal ground Receiver power supply Receiver optical input level monitor Receiver data out bar Receiver data out Transmitter power supply Transmitter signal ground Transmitter disable Transmitter data in Transmitter data in bar Mounting studs Housing leads
VEEr VCCr
SD RD- RD+
VCCt VEEt
TDis TD+ TD-
Data Sheet
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Pin Configuration
VEEr / VEEt
Connect pins 1 and 7 to signal ground.
VCCr / VCCt
A 3.3 V DC power supply must be applied at pins 2 and 6. A recommended power supply filter network is given in the termination scheme. Locate power supply filtering directly at the transceiver power supply pins. Proper power supply filtering is essential for good EMI performance. TD+ / TD- Transmitter data LVPECL level inputs. Terminated and AC coupled internally. RD- / RD+ Receiver data LVPECL level outputs. Biased and AC coupled internally. TDis A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input must be applied. Leave pin unconnected if feature not required. SD LVTTL output. A logical high output indicates normal optical input levels to the receiver. Low optical input levels at the receiver result in a low output. Signal Detect can be used to determine a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source. However it is not a detection of a bad link due to data-related errors. MS Mounting studs are provided for transceiver mechanical attachment to the circuit board. They also provide an optional connection of the transceiver to the equipment chassis ground. The holes in the circuit board must be tied to chassis ground. HL Housing leads are provided for additional signal grounding. The holes in the circuit board must be included and tied to signal ground.
Data Sheet
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Description Description The Infineon Gigabit Ethernet multimode transceiver - part of Infineon Small Form Factor transceiver family - is based on and compliant to the Physical Medium Depend (PMD) sublayer and baseband medium, type 1000-Base-SX (short wavelength) as specified in IEEE 802.3 and Fibre Channel FC-PI Rev. 13 100-M5-SN-I, 100-M6-SN-I. The appropriate fiber optic cable is 62.5 m or 50 m multimode fiber with LCTM connector. Operating Range over each Optical Fiber Type Fiber Type min. 62.5 micron MMF 50.0 micron MMF 0.5 0.5 Limit Values typ. 2 to 300 2 to 550 max. 400 700 meters Unit
The Infineon Gigabit Ethernet multimode transceiver is a single unit comprised of a transmitter, a receiver, and an LCTM receptacle. This design frees the customer from many alignment and PC board layout concerns. This transceiver supports the LCTM connectorization concept. It is compatible with RJ-45 style backpanels for high end Data Com and Telecom applications while providing the advantages of fiber optic technology. The module is designed for low cost SAN, LAN, WAN, Fibre Channel and Gigabit Ethernet applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at 1.0625 and 1.25 Gbit/s from a single power supply (+3.3 V). The full differential data inputs and outputs are LVPECL compatible.
Data Sheet
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Description Functional Description of 2x5 Pin Row Transceiver This transceiver is designed to transmit serial data via multimode cable.
Automatic Shut-Down TxDis LEN TD- TD+ Laser Driver Power Control Monitor RD- RD+ SD Receiver Tx Coupling Unit
e/o
Laser
o/e
Rx Coupling Unit
o/e
Multimode Fiber
File: 1358
Figure 2
Functional Diagram
The receiver component converts the optical serial data into LVPECL compatible electrical data (RD+ and RD-). The Signal Detect (SD) shows whether an optical signal is present. The transmitter converts LVPECL compatible electrical serial data (TD+ and TD-) into optical serial data. Data lines are differentially 100 W terminated. The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Single fault condition is ensured by means of an integrated automatic shutdown circuit that disables the laser when it detects laser fault to guarantee the laser Eye Safety. The transceiver contains a supervisory circuit to control the power supply. This circuit makes an internal reset signal whenever the supply voltage drops below the reset threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage has risen above the reset threshold. During this time the laser is inactive. A low signal on TxDis enables transmitter. If TxDis is high the transmitter is disabled.
Data Sheet
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Description Regulatory Compliance Feature ESD: Electrostatic Discharge to the Electrical Pins Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle Immunity: Against Radio Frequency Electromagnetic Field Emission: Electromagnetic Interference (EMI) Standard EIA/JESD22-A114-B (MIL-STD 883D Method 3015.7) EN 61000-4-2 IEC 61000-4-2 Comments Class 1C
Discharges ranging from 2 kV to 15 kV on the receptacle cause no damage to transceiver (under recommended conditions). With a field strength of 3 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Noise frequency range: 30 MHz to 18 GHz
EN 61000-4-3 IEC 61000-4-3
FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22
Data Sheet
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Technical Data Technical Data Absolute Maximum Ratings Parameter Package Power Dissipation Data Input Levels Differential Data Input Voltage Swing Storage Ambient Temperature Soldering Conditions, Temp/Time (MIL-STD 883C, Method 2003) Symbol Limit Values min. max. 0.6 W V V C C/s V mA Unit
VCC+0.5 VIDpk-pk
-40 5 85 250 /5.5 5.5 50
VCC max.
PECL Output Current
Exceeding any one of these values may destroy the device immediately. Recommended Operating Conditions Parameter Ambient Temperature Power Supply Voltage Transmitter Data Input High Voltage DC/DC VIH-VCC Data Input Low Voltage DC/DC Differential Data Input Voltage Swing AC/AC Receiver Input Center Wavelength -1165 -1810 500 -880 -1475 3200 mV mV mV Symbol min. Limit Values typ. 3.3 max. 70 3.5 C V 0 3.1 Unit
TAMB VCC-VEE
VIL-VCC VIDpk-pk
lC
770
860
nm
The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions.
Data Sheet
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Technical Data Transmitter Electro-Optical Characteristics Parameter Output Power (Average)1) Optical Modulation Amplitude2) Center Wavelength Spectral Width (RMS) Relative Intensity Noise Extinction Ratio (Dynamic) Total Tx Jitter Reset Threshold
3)
Symbol min.
Limit Values typ. -6 450 850 860 0.85 -116 9 2.2 140 13 53 2.7 240 65 130 2.99 560 260 75 max. -4 -9.5 156 830
Unit dBm W nm nm dB/Hz dB ps V ms ps mA
PO
OMA
lC sl
RIN ER TJ
Reset Time Out3) Rise Time, 20% - 80% Power Supply Current
1) 2) 3)
VTH tRES tR
Into multimode fiber, 62.5 m or 50 m diameter. Fibre Channel PI Standard. Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES.
Data Sheet
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Technical Data Receiver Electro-Optical Characteristics Parameter Sensitivity (Average Power) Min. Optical Modulation Amplitude2) Stressed Receiver Sensitivity 50 m Fiber Stressed Receiver Sensitivity 62.5 m Fiber Signal Detect Assert Level5) Signal Detect Deassert Level6) Signal Detect Hysteresis Signal Detect Assert Time Signal Detect Deassert Time Receiver 3 dB Cut-off Frequency2) Receiver 10 dB Cut-off Frequency2) Differential Data Output Voltage VODpk-pk Swing AC/AC7) Return Loss of Receiver Output Data Rise/Fall Time Supply Current 8)
1) 2) 3)
Symbol min.
1)
Limit Values typ. -20 0 19 24 -17 32 -16 -24 -30 -27 3 100 350 1.25 1.5 500 12 260 75 90 700 1.5 3 1230 31 55 -13.5 67 -12.5 -18 max. -17
Unit dBm W W3) dBm4) W3) dBm4) dBm dBm dB s s GHz GHz mV dB ps mA
Saturation (Average Power)
PIN PSAT
OMA
SPIN SPIN PSDA PSDD PSDA
-PSDD
tASS tDAS
ORL
tR , tF ICCRx
4) 5)
6)
7)
8)
Average optical power at which the BER is 1x10-12. Measured with a 27-1 NRZ PRBS and ER = 9 dB. Fibre Channel PI Standard. Measured at the given Stressed Receiver Eyeclosure Penalty and DCD component given in Fibre Channel PI Standard (2.03/2.18 dB & 40/80 ps). Measured according to IEEE 802.3 An increase in optical power above the specified level will cause the Signal Detect output to switch from a low state to a high state. A decrease in optical power below the specified level will cause the Signal Detect to change from a high state to a low state. AC/AC for data. Load 50 W to GND or 100 W differential. For dynamic measurement a tolerance of 50 mV should be added. Supply current excluding Rx output load.
Data Sheet
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Eye Safety Eye Safety This laser based multimode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. To meet laser safety requirements the transceiver shall be operated within the maximum operating limits. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of "manufacturing", and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength Total output power (as defined by IEC: 7 mm aperture at 14 mm distance) Total output power (as defined by FDA: 7 mm aperture at 20 cm distance) Beam divergence 850 nm < 675 W < 70 W 12
FDA
Complies with 21 CFR 1040.10 and 1040.11
IEC
Class 1 Laser Product
File: 1401
Figure 3
Required Labels
Indication of laser aperture and beam
Tx Top view Rx
10 9 8 7 6
12345
File: 1332
Figure 4
Laser Emission
Data Sheet
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Application Notes Application Notes Small Form Factor Pinning Comparison The drawing below gives you a comparison between the different pinnings 2x5, 2x6, 2x10. Dimension for diameter and distance of additional pins is similar to the existing dimensions of the other pins.
Top view Rx
VCCPIN 1 RxVEE 2 RxVEE 3 RxCLK- 4 RxCLK+ 5 RxVEE 6 RxVCC 7 SD 8 RxD- 9 RxD+ 10
Tx
20 19 18 17 16 15 14 13 12 11 PMON+ PMON- BIASMON+ BIASMON- TxVEE TxD- TxD+ TxDis TxVEE TxVCC
RxVEE RxVCC SD RxD- RxD+
1 2 3 4 5
RS RxVEE RxVCC SD RxD- RxD+
1 2 3 4 5 6
12 11 10 9 8 7
Laser Fault TxD- TxD+ TxDis TxVEE TxVCC
10 9 8 7 6
TxD- TxD+ TxDis TxVEE TxVCC
2 x 10 2x6 2x5
File: 1506
Figure 5 Pin Description RS pin - The RS (Rate Select) is not connected. LF pin - The LF pin (Laser Fault) is an LVTTL output of the Laser Driver Supervisor Circuit. A Logic 1 level can be measured in case of a laser fault. It will not show a fault if the laser is being disabled using the TxDis input, since this is not a fault condition. EMI-Recommendations To avoid electromagnetic radiation exceeding the required limits please take note of the following recommendations. When Gigabit switching components are found on a PCB (multiplexers, clock recoveries etc.) any opening of the chassis may produce radiation also at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as possible. On the board itself every data connection should be an impedance matched line (e.g. strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should be avoided. A terminating resistor of 100 W should be placed at the end of each matched
Data Sheet 11 2003-01-22
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Application Notes line. An alternative termination can be provided with a 50 W resistor at each (D, Dn). In DC coupled systems a thevenin equivalent 50 W resistance can be achieved as follows: for 3.3 V: 125 W to VCC and 82 W to VEE, for 5 V: 82 W to VCC and 125 W to VEE at Data and Datanot. Please consider whether there is an internal termination inside an IC or a transceiver. In certain cases signal GND is the most harmful source of radiation. Connecting chassis GND and signal GND at the plate/ bezel/ chassis rear e.g. by means of a fiber optic transceiver may result in a large amount of radiation. Even a capacitive coupling between signal GND and chassis may be harmful if it is too close to an opening or an aperture. If a separation of signal GND and chassis GND is not planned, it is strongly recommended to provide a proper contact between signal GND and chassis GND at every location where possible. This concept is designed to avoid hotspots. Hotspots are places of highest radiation which could be generated if only a few connections between signal and chassis GND exist. Compensation currents would concentrate at these connections, causing radiation. By use of Gigabit switching components in a design, the return path of the RF current must also be considered. Thus a split GND plane of Tx and Rx portion may result in severe EMI problems. A recommendation is to connect the housing leads to signal GND. However, in certain applications it may improve EMI performance by connecting them to chassis GND. The cutout should be sized so that all contact springs make good contact with the face plate. Please consider that the PCB may behave like a waveguide. With an er of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. In this scenario even the smallest PCBs may have unexpected resonances.
(13.97) *) .550
*) min. pitch between SFF transceiver according to MSA. Dimensions in (mm) inches
File: 1501
Figure 6
Data Sheet
Transceiver Pitch
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Recommended Termination Schemes Recommended Termination Schemes 2x5 DC/DC Transceiver
VEEt TD+ Laser Driver 100 TD- TDis VCCt
7 9 C6
VCC SerDes VCC SerDat Out +
10 C8 8 6 C1 TDis
C7
SerDat Out -
ECL/ PECL Driver
R4
SFF Transceiver VCCr 2
R5
L1
VCC 3.3 V
L2 C3 C2 C10
Serializer/ Deserializer
Signal Detect
SD
3
SD
PreAmp
Limiting Amplifier
RD-
RD-
4
C4 R1
SerDat In - Receiver PLL etc.
RD+
RD+
5
C9
C5
SerDat In +
C1/2/3 = 4.7 ... 10 F C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1 = 100 (depending on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip). R2/3 = 150 R4/5 = Biasing for outputs depending on Serializer. Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1392
Figure 7
Data Sheet
R2
13
R3
VEEr
1
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Recommended Termination Schemes 2x5 AC/AC Transceiver
VCC SerDes VEEt TD+ Laser Driver 100 TD- TDis VCCt 7 9 VCC SerDat Out +
10 C4 8 6 C1 TDis R5 R6 L1 VCC 3.3 V
SerDat Out -
ECL/ PECL Driver
SFF Transceiver VCCr 2
L2 C3 C2 C6
Serializer/ Deserializer
Signal Detect
SD
3
SD R1 R2 SerDat In - C5 SerDat In + Receiver PLL etc. R4
PreAmp
Limiting Amplifier
RD-
RD-
4
RD+
RD+
5
VEEr
1 R3
C1/2/3 C4/5/6
= 4.7 ... 10 F = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip. = Biasing (depends on SerDes chip). R5/6 Place R1/2/3/4/5/6 close to SerDes chip.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1393
Figure 8
Data Sheet
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Package Outlines Package Outlines
a) recommended bezel position
Drawing shown is with collar
Dimensions in mm [inches]
File: 1212
Figure 9
Data Sheet
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V23818-K305-Lxx Revision History: Previous Version: Page 2003-01-22 2002-03-22 DS1
Subjects (major changes since last revision) Document completely revised; V23818-K305-L15 and V23818-K305-L55 added
For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com.
Edition 2003-01-22 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 Munchen, Germany
(c) Infineon Technologies AG 2002.
All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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